Title:
EMBEDDED CIRCUIT BOARD AND FABRICATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/004459
Kind Code:
A1
Abstract:
The present application mainly provides an embedded circuit board and a fabrication method therefor. The embedded circuit board comprises: a core board, provided with a slot; at least one chip, provided in the slot and having a lead-out terminal; a first insulating layer and a second insulating layer, provided on opposite sides of the core board, respectively; an embedded resistor material layer, provided on one side of the second insulating layer facing away from the core board; and a first circuit layer, provided on one side of the first insulating layer facing away from the core board. The present application can greatly reduce the thickness of the circuit board and the whole chip product.
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Inventors:
HUANG LIXIANG (CN)
WANG ZEDONG (CN)
WANG ZEDONG (CN)
Application Number:
PCT/CN2020/100696
Publication Date:
January 14, 2021
Filing Date:
July 07, 2020
Export Citation:
Assignee:
SHENNAN CIRCUITS CO LTD (CN)
International Classes:
H05K1/18
Foreign References:
| CN105047630A | 2015-11-11 | |||
| CN105047630A | 2015-11-11 | |||
| CN103489841A | 2014-01-01 | |||
| CN103188882A | 2013-07-03 | |||
| CN201345363Y | 2009-11-11 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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