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Title:
EMBEDDED PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2015/111923
Kind Code:
A1
Abstract:
An embedded printed circuit board of the present invention comprises: an insulating substrate; a first element disposed at one surface side of the insulating substrate; and a second element disposed at the other surface side of the insulating substrate.

Inventors:
KIM WOO YOUNG (KR)
Application Number:
PCT/KR2015/000650
Publication Date:
July 30, 2015
Filing Date:
January 21, 2015
Export Citation:
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Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K3/46; H05K1/18
Foreign References:
KR20120036044A2012-04-17
JP2013038374A2013-02-21
JP2011138869A2011-07-14
KR20090002718A2009-01-09
US20070000687A12007-01-04
Attorney, Agent or Firm:
KIM, IN HAN (KR)
김인한 (KR)
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