Title:
EMBEDDED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/024813
Kind Code:
A1
Abstract:
The present application relates to the technical field of integrated circuits, and provides an embedded substrate, for use in resolving the problem in the prior art of limitation of further improvement of package integration of an embedded substrate due to large footprints used by all chips of the embedded substrate and low product reliability of the embedded substrate. The embedded substrate comprises: a substrate, two sides of the substrate in the thickness direction being separately provided with at least one first cavity; at least two first electronic elements, each of the first electronic elements corresponding to one first cavity; packaging layers, which are respectively disposed in the first cavities, respectively cover the first electronic elements in the first cavities, and are separately provided with a plurality of first connection holes, each of the first connection holes corresponding to one pin of one first electronic element and being connected to the corresponding pin; and a conductive circuit layer, part of the conductive circuit layer being disposed in the plurality of first connection holes and connected to the pins corresponding to the first connection holes.
Inventors:
PENG HAO (CN)
LIAO XIAOJING (CN)
WANG JUNHE (CN)
LIAO XIAOJING (CN)
WANG JUNHE (CN)
Application Number:
PCT/CN2018/097605
Publication Date:
February 07, 2019
Filing Date:
July 27, 2018
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/498; H01L23/31
Domestic Patent References:
| WO2017109536A1 | 2017-06-29 |
Foreign References:
| CN107611114A | 2018-01-19 | |||
| CN104218016A | 2014-12-17 | |||
| CN103311214A | 2013-09-18 | |||
| CN101192586A | 2008-06-04 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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