Title:
EMBEDDING METHOD AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/189667
Kind Code:
A1
Abstract:
Provided is an embedding method for embedding a predetermined element-containing film into a recess formed in a substrate, the method comprising the steps of: (a) forming a first film of the predetermined element-containing film in a first chamber; (b) exposing the first film to a gas including a halogen-containing gas to form a modified layer in a second chamber; (c) forming a protective film covering the modified layer in the second chamber; (d) etching the protective film and sublimating the modified layer in a third chamber; and (e) forming a second film of the predetermined element-containing film in the third chamber.
Inventors:
MURAKAMI HIROKI (JP)
Application Number:
PCT/JP2023/010360
Publication Date:
October 05, 2023
Filing Date:
March 16, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/318; C23C16/40; C23C16/42; H01L21/31; H01L21/316
Domestic Patent References:
| WO2019003662A1 | 2019-01-03 |
Foreign References:
| JP2017053024A | 2017-03-16 | |||
| JP2020532124A | 2020-11-05 | |||
| US10163623B1 | 2018-12-25 | |||
| JP2008141124A | 2008-06-19 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Download PDF: