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Title:
EMBOSSING DEVICE AND EMBOSSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/031159
Kind Code:
A1
Abstract:
In this embossing device (10), an embossing roll (20) has a rugged molding part (22) on the outer circumference thereof. A first backup roll (24), together with the embossing roll (20), takes in and pinches a base material (85). First heating parts (60) heat the first backup roll (24). A second backup roll (26), together with the embossing roll (20), takes in and pinches the base material (85). A contact part (30) is disposed in a first range (R1) so as to face the embossing roll (20). The contact part (30) comes into contact with the rear surface of the base material (85).

Inventors:
YOSHIMURA, Masaru (10-1, Keya 1-chome, Fukui-sh, Fukui 60, 〒9188560, JP)
Application Number:
JP2018/026482
Publication Date:
February 14, 2019
Filing Date:
July 13, 2018
Export Citation:
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Assignee:
SEIREN CO., LTD. (10-1, Keya 1-chome Fukui-sh, Fukui 60, 〒9188560, JP)
International Classes:
B29C59/04; B31F1/07
Foreign References:
JP2007261202A2007-10-11
JP2007098742A2007-04-19
JPS55111224A1980-08-27
JP2009050538A2009-03-12
JP2002086562A2002-03-26
JP2016159476A2016-09-05
Attorney, Agent or Firm:
KITAGAWA, Yasutaka (608-2, Monzen 2-chome Fukui-sh, Fukui 21, 〒9188021, JP)
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