Title:
EMI SHIELDING STRUCTURE HAVING HEAT DISSIPATION UNIT AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2018/131815
Kind Code:
A1
Abstract:
An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.
Inventors:
HAN EUN-BONG (KR)
KIM HYEN-HYANG (KR)
KIM HYEN-HYANG (KR)
Application Number:
PCT/KR2017/015031
Publication Date:
July 19, 2018
Filing Date:
December 19, 2017
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K9/00; H05K7/20
Foreign References:
US20150282387A1 | 2015-10-01 | |||
US20160262292A1 | 2016-09-08 | |||
US20160295679A1 | 2016-10-06 | |||
JP2014049536A | 2014-03-17 | |||
KR20160142720A | 2016-12-13 |
Attorney, Agent or Firm:
KIM, Tae-hun et al. (KR)
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