Title:
EMULSION TYPE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/114010
Kind Code:
A1
Abstract:
Provided is an emulsion type aqueous adhesive composition which exhibits excellent liquid stability in spite of low viscosity thereof, and which enables the achievement of an adhesive layer that has excellent adhesive power and tack properties.
An emulsion type adhesive composition which contains 51-90% by mass of (A) an acrylic adhesive emulsion having a low Tg and 10-49% by mass of (B) a copolymer emulsion having a high Tg, and which has solid contents of 50% or more and a viscosity of 1,000 mPa·s or less. The emulsion (A) has a Tg of from -70°C to -50°C. The emulsion (B) is an emulsion of a copolymer that is obtained by emulsion polymerizing 100 parts by mass of a monomer mixture, which contains an alkyl (meth)acrylate monomer, in the presence of 20-200 parts by mass of a tackifying resin; and the copolymer has a Tg of from -30°C to 30°C, a weight average molecular weight of from 5,000 to 70,000 and an average particle diameter of from 200 nm to 2,000 nm.
More Like This:
Inventors:
UMEMIYA HIROKAZU (JP)
HAMADA TAKEHIKO (JP)
HAMADA TAKEHIKO (JP)
Application Number:
PCT/JP2015/082958
Publication Date:
July 21, 2016
Filing Date:
November 24, 2015
Export Citation:
Assignee:
SAIDEN CHEMICAL IND CO LTD (JP)
International Classes:
C09J11/08; C09J133/00; C09J133/04; C09J151/00
Foreign References:
| JPS5958069A | 1984-04-03 | |||
| JP2005239875A | 2005-09-08 | |||
| JP2006509890A | 2006-03-23 | |||
| US20030077443A1 | 2003-04-24 | |||
| JP2012126889A | 2012-07-05 |
Other References:
See also references of EP 3246372A4
Attorney, Agent or Firm:
KONDO Rieko et al. (JP)
Kondo Toshihide child (JP)
Kondo Toshihide child (JP)
Download PDF:
Previous Patent: FUSION GENE ANALYSIS DEVICE, FUSION GENE ANALYSIS METHOD, AND PROGRAM
Next Patent: DISPLAY DEVICE AND ELECTRONIC DEVICE
Next Patent: DISPLAY DEVICE AND ELECTRONIC DEVICE