Title:
ENCAPSULATION FILM AND CURED PRODUCT THEREOF, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/092606
Kind Code:
A1
Abstract:
An encapsulation film comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler, wherein the content of a liquid component or liquid components each having a liquid form at 25ºC, among the components (A) to (C), is 20 to 30% by mass relative to the total mass of the components (A) to (D), the content of the component (D) relative to the total mass of the components (A) to (D) is 70 to 80% by mass, and the content of a solvent is 0.05% by mass or less relative to the whole mass of the encapsulation film.
Inventors:
KANEKO TOMOYO (JP)
FUJIMOTO DAISUKE (JP)
NOMURA YUTAKA (JP)
OGIHARA HIROKUNI (JP)
WATASE YUSUKE (JP)
FUJIMOTO DAISUKE (JP)
NOMURA YUTAKA (JP)
OGIHARA HIROKUNI (JP)
WATASE YUSUKE (JP)
Application Number:
PCT/JP2017/039793
Publication Date:
May 24, 2018
Filing Date:
November 02, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/40; C08J5/18; H01L23/29; H01L23/31
Domestic Patent References:
| WO2016117237A1 | 2016-07-28 | |||
| WO2016072463A1 | 2016-05-12 |
Foreign References:
| JP2003002951A | 2003-01-08 | |||
| JP2014080455A | 2014-05-08 | |||
| JP2000007891A | 2000-01-11 | |||
| JP2016141757A | 2016-08-08 | |||
| JP2015134928A | 2015-07-27 | |||
| JP2007182562A | 2007-07-19 | |||
| JP2003034747A | 2003-02-07 | |||
| JP2001270976A | 2001-10-02 | |||
| JPH11106474A | 1999-04-20 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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