Title:
ENCAPSULATION FILM
Document Type and Number:
WIPO Patent Application WO/2017/171518
Kind Code:
A1
Abstract:
The present invention relates to an encapsulation film, a method for manufacturing the same, a method for manufacturing an organic electronic device using the same, and an organic electronic device comprising the same. The present invention provides an encapsulation film which can form a structure capable of effectively blocking moisture or oxygen which is introduced into an organic electronic device from the outside, and has excellent handling and processability as well as excellent durability and bonding properties between an encapsulation layer and a panel.
Inventors:
LEE JUNG WOO (KR)
YOO HYUN JEE (KR)
KIM HYUN SUK (KR)
MOON JUNG OK (KR)
YANG SE WOO (KR)
YOO HYUN JEE (KR)
KIM HYUN SUK (KR)
MOON JUNG OK (KR)
YANG SE WOO (KR)
Application Number:
PCT/KR2017/003637
Publication Date:
October 05, 2017
Filing Date:
April 03, 2017
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C09J7/28; C09K3/10; H01L51/52
Foreign References:
| KR101251641B1 | 2013-04-05 | |||
| KR101589754B1 | 2016-01-28 | |||
| KR0157513B1 | 1998-12-01 | |||
| JP2001324720A | 2001-11-22 | |||
| JP2006156150A | 2006-06-15 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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