Title:
ENCAPSULATION MATERIAL FOR OPTICAL MODULE, METHOD FOR MANUFACTURING SAME, AND OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2015/130101
Kind Code:
A1
Abstract:
The present application relates to an encapsulation material for an optical module, a method for manufacturing same, and an optical module. The encapsulation material, according to the present application, has improved creep properties by having excellent heat resistance, thus is subject to less deformation and can show excellent adhesive force even when used for a long time in high-temperature and/or highly humid conditions, thereby improving durability when applied in an optical module.
Inventors:
JUNG JE SIK (KR)
KIM HYUN CHEOL (KR)
LEE JUNG YOUN (KR)
KIM HYUN CHEOL (KR)
LEE JUNG YOUN (KR)
Application Number:
PCT/KR2015/001873
Publication Date:
September 03, 2015
Filing Date:
February 26, 2015
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08L23/08; C08L23/26; H05B33/04
Foreign References:
| KR101314496B1 | 2013-10-07 | |||
| JP5072211B2 | 2012-11-14 | |||
| JP2012216805A | 2012-11-08 | |||
| KR20100123505A | 2010-11-24 | |||
| KR20120078026A | 2012-07-10 |
Other References:
See also references of EP 3112415A4
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
특허법인 다나 (KR)
특허법인 다나 (KR)
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