Title:
ENCAPSULATION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/251424
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an encapsulation method using a cover film that has few issues in terms of odor, and has good quick-drying and encapsulation properties. An encapsulation method according to the present invention is performed using at least an encapsulation solvent and a cover film in which a polymer layer is provided on a transparent support, wherein: the encapsulation solvent contains at least one selected from the group consisting of an ester, an alcohol, a ketone, an ether, and an aromatic hydrocarbon; and when the encapsulation solvent is an ester, an alcohol, a ketone, or an ether, the encapsulation solvent has a boiling point of 80-170 °C, and when the encapsulation solvent is an aromatic hydrocarbon, the encapsulation solvent has a boiling point of 150-170 °C.
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Inventors:
UMEHARA TAKESHI (JP)
MITSUI TETSURO (JP)
HARA MIYOKO (JP)
SASAHARA KANA (JP)
TAMURA AKIO (JP)
INUSHIMA REIKO (JP)
MITSUI TETSURO (JP)
HARA MIYOKO (JP)
SASAHARA KANA (JP)
TAMURA AKIO (JP)
INUSHIMA REIKO (JP)
Application Number:
PCT/JP2021/021886
Publication Date:
December 16, 2021
Filing Date:
June 09, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09D5/00; C09D7/20; C09D133/06; C09J7/38; C09J11/06; C09J133/06; G01N1/28; G02B21/34
Foreign References:
| JPH08105827A | 1996-04-23 | |||
| JPH0513577B2 | 1993-02-22 | |||
| JPH01203940A | 1989-08-16 | |||
| JP2004506228A | 2004-02-26 | |||
| JPH11101943A | 1999-04-13 | |||
| JPH11101943A | 1999-04-13 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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