Title:
ENCODER
Document Type and Number:
WIPO Patent Application WO/2020/208773
Kind Code:
A1
Abstract:
This encoder comprises a light-projection-and-reception-module package (3) comprising a package substrate (30) and a light-transmitting resin (33) covering a mounting surface (30a) of the substrate. The light-transmitting resin (33) has a first region (33a) that covers an area of the mounting surface (30a) where a light-emission element (31) is provided and a second region (33b) that covers an area of the mounting surface (30a) where a light-reception element (32) and a bonding wire (35) connecting the light-reception element (32) and the substrate are provided. The thickness of the light-transmitting resin (33) in the direction perpendicular to the mounting surface (30a) is thinner in at least a portion of the second region (33b) than in the first region (33a), or the length of the light-transmitting resin (33) in a direction that is parallel to the mounting surface (30a) and in which the light-emission element (31) and light-reception element (32) are aligned is shorter in at least a portion of the second region (33b) than in the first region (33a).
Inventors:
KUBO YUJI (JP)
NIMURA MASANORI (JP)
MEKATA TOSHIO (JP)
NOGUCHI TAKUYA (JP)
JIMBO SHIGEO (JP)
NIMURA MASANORI (JP)
MEKATA TOSHIO (JP)
NOGUCHI TAKUYA (JP)
JIMBO SHIGEO (JP)
Application Number:
PCT/JP2019/015769
Publication Date:
October 15, 2020
Filing Date:
April 11, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G01D5/347
Domestic Patent References:
| WO2018163424A1 | 2018-09-13 |
Foreign References:
| JP2010223630A | 2010-10-07 | |||
| JP2004061495A | 2004-02-26 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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