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Title:
ENDOSCOPE ADHESIVE, CURED MATERIAL, ENDOSCOPE, AND METHOD FOR MANUFACTURING ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2019/044754
Kind Code:
A1
Abstract:
The present invention is: a two-component endoscope adhesive having a main agent and a curing agent, wherein the main agent includes at least one type of epoxy resin (A) from among a bisphenol-A-type epoxy resin, a bisphenol-F-type epoxy resin, and a phenol novolac-type epoxy resin, the curing agent includes at least one type of specific polyamine compound (B), and the endoscope adhesive is used for fixing a metal member and/or a glass member constituting part of an endoscope; a cured material of the endoscope adhesive; an endoscope fabricated using the endoscope adhesive; and a method for manufacturing the endoscope.

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Inventors:
FURUKAWA KAZUSHI (JP)
YOSHITANI TOSHIHIDE (JP)
NAKAI YOSHIHIRO (JP)
Application Number:
PCT/JP2018/031542
Publication Date:
March 07, 2019
Filing Date:
August 27, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
A61B1/00; C09J163/02; C09J163/04; C09J179/02; G02B23/24
Domestic Patent References:
WO2006013860A12006-02-09
Foreign References:
JP2002238834A2002-08-27
JP2011212338A2011-10-27
JP2015117283A2015-06-25
JP2017165917A2017-09-21
Other References:
See also references of EP 3677164A4
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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