Title:
ENDOSCOPE COMPONENT MOLDING METHOD AND ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2022/050266
Kind Code:
A1
Abstract:
Provided are an endoscope component molding method with which it is possible to prevent a molding material from flowing out while an endoscope component and a twisted wire are molded integrally; and an endoscope. This endoscope component molding method comprises: a step for forming, at one end of a twisted wire (40), a covering part (150) which has a gap filling member (152) for filling gaps formed among a plurality of strands (40a); a step for inserting and placing the one end of the twisted wire (40) into a cavity (106) of a mold (100) such that the covering part (150) is positioned at a boundary portion between the inside and the outside of the endoscope component; a step for injecting and filling into the cavity (106) a molding material (108), which is a material for the endoscope component, and integrally molding the endoscope component and the twisted wire (40); and a step for extracting from the mold (100) the endoscope component molded integrally with the twisted wire (40).
Inventors:
HARADA TAKASHI (JP)
FUKUSHIMA KIMITAKE (JP)
FUKUSHIMA KIMITAKE (JP)
Application Number:
PCT/JP2021/031911
Publication Date:
March 10, 2022
Filing Date:
August 31, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G02B23/24; A61B1/018
Domestic Patent References:
| WO2017061338A1 | 2017-04-13 |
Foreign References:
| JPH06315459A | 1994-11-15 | |||
| JP2002153420A | 2002-05-28 | |||
| JP2001157661A | 2001-06-12 | |||
| JPS59144434A | 1984-08-18 | |||
| JPS5949515A | 1984-03-22 | |||
| JP2014054753A | 2014-03-27 | |||
| JP2010240312A | 2010-10-28 |
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
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