ENDOSCOPE - HOYA CORP

Title:

ENDOSCOPE

Document Type and Number:

WIPO Patent Application WO/2021/100781

Kind Code:

A1

Abstract:

Provided is an endoscope which is capable of suppressing wear and damage to a treatment tool conduit while maintaining flexibility for an insertion part. This endoscope comprises: an insertion part; a base end manipulative part to which one end of the insertion part is connected; a first treatment tool conduit which passes through the inside of the insertion part and the base end manipulative part, wherein a treatment tool is inserted therein from the upper end of the base end manipulative part; and a second treatment tool conduit which passes through the inside of the insertion part and the base end manipulative part and has a branch part which branches into a first branch and a second branch at the base end manipulative part, wherein a treatment tool is inserted therein from the first branch. The first treatment tool conduit includes a first portion which has a first hardness at least in a grip part of the base end manipulative part and a second portion which has a second hardness that is lower than the first hardness.

Inventors:

HIRAYAMA TETSU (JP)
KOBAYASHI TAKAHIRO (JP)
NAITO NAOYUKI (JP)

Application Number:

PCT/JP2020/043065

Publication Date:

May 27, 2021

Filing Date:

November 18, 2020

Export Citation:

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Assignee:

HOYA CORP (JP)

International Classes:

A61B1/018

Domestic Patent References:

WO2018088087A1	2018-05-17
WO2012005124A1	2012-01-12
WO2018088087A1	2018-05-17

Foreign References:

JPS5920142A	1984-02-01
JP2008054786A	2008-03-13
JP2007289467A	2007-11-08
JP2003088494A	2003-03-25
JP2001046314A	2001-02-20
JPH10262917A	1998-10-06
JPH10234657A	1998-09-08
JPH08215134A	1996-08-27
JP2001046314A	2001-02-20

Other References: