ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE SAME PLATEN IN CHEMICAL MECHANICAL POLISHING

WIPO Patent Application WO/2012/030475

A4

A difference between a first expected required polish time for a first substrate and a second expected required polish time for a second substrate is determined using a first prepolish thickness and a second pre-polish thickness measured at an in-line metrology station. A duration of an initial period is determined based on the difference between the first expected required polish time and the second expected required polish time. For the initial period at a beginning of a polishing operation, no pressure is applied to whichever of the first substrate and the second substrate has a lesser expected required polish time while simultaneously pressure is applied to whichever of the first substrate and the second substrate has a greater expected required polish time. After the initial period, pressure is applied to both the first substrate and the second substrate.

DUBOUST ALAIN (US)
JEW STEPHEN (US)
MAI DAVID H (US)
TRAN HUYEN (US)
TU WEN-CHIANG (US)
SHEN SHIH-HAUR (US)
ZHANG JIMIN (US)
CARLSSON INGEMAR (US)
SWEDEK BOGUSLAW A (US)
WANG ZHIHONG (US)

PCT/US2011/046660

August 16, 2012

August 04, 2011

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APPLIED MATERIALS INC (US)
DUBOUST ALAIN (US)
JEW STEPHEN (US)
MAI DAVID H (US)
TRAN HUYEN (US)
TU WEN-CHIANG (US)
SHEN SHIH-HAUR (US)
ZHANG JIMIN (US)
CARLSSON INGEMAR (US)
SWEDEK BOGUSLAW A (US)
WANG ZHIHONG (US)

H01L21/304; H01L21/66

GOREN, David J. (P.O. Box 1022Minneapolis, Minnesota, US)

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