Title:
ENERGY BEAM-CURABLE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2016/024357
Kind Code:
A1
Abstract:
This invention provides a curable adhesive with excellent thermal cycle resistance. An energy beam curable adhesive includes: (A) 100 parts by mass of (meth)acrylate; (B) 25-150 parts by mass of polyolefin particles; (C) an inorganic filler; and (D) a photoradical polymerization initiator. The (A) (meth)acrylate may include a (A1) monofunctional (meth)acrylate and a (A2) polyfunctional (meth)acrylate. The (B) polyolefin particles may include polyethylene particles and/or polypropylene particles.
Inventors:
GOTO YOSHITSUGU (JP)
YUASA JUNICHI (JP)
TAKEMA JUNICHIRO (JP)
YODA KIMIHIKO (JP)
YUASA JUNICHI (JP)
TAKEMA JUNICHIRO (JP)
YODA KIMIHIKO (JP)
Application Number:
PCT/JP2014/071451
Publication Date:
February 18, 2016
Filing Date:
August 14, 2014
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
International Classes:
C09J4/02; C08F2/44; C09J11/04; C09J11/06; C09J11/08; C09J123/00
Foreign References:
| JPH0790028A | 1995-04-04 | |||
| JP2012144641A | 2012-08-02 | |||
| JPH1077308A | 1998-03-24 | |||
| JP2001311068A | 2001-11-09 | |||
| JP2011241290A | 2011-12-01 | |||
| JP2007056066A | 2007-03-08 | |||
| JP2011502199A | 2011-01-20 | |||
| JP2014152191A | 2014-08-25 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
SK patent business corporation (JP)
SK patent business corporation (JP)
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