Title:
ENERGY-BEAM-CURABLE THERMAL-RELEASABLE PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR PRODUCING CUT PIECES USING THE SAME
Document Type and Number:
WIPO Patent Application WO2002033018
Kind Code:
A3
Abstract:
An energy-beam-curable thermal-realeasable pressure sensitive adhesive sheet has, on at least one side of a base material, an energy-beam-curable viscoelastic layer and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres stacked in this order. The energy-beam-curable viscoelastic layer is, for example, composed of a composition of an organic viscoelastic body and an energy-beam-curable compound or an energy-beam-curable resin. The energy-beam-curable viscoelastic layer has a thickness of about 5 to 300 mu m or may be not greater than the maximum particle size of the thermo-expandable microspheres. The energy-beam-curable thermal-releasable pressure-sensitive adhesive layer according to the invention has adhesion enough to withstand a carrying step of an adherend, causes neither winding up of the adhesive nor chipping upon cutting and facilitates peeling and collection of cut pieces after cutting.
Inventors:
KIUCHI KAZUYUKI (JP)
OSHIMA TOSHIYUKI (JP)
MURATA AKIHISA (JP)
ARIMITSU YUKIO (JP)
OSHIMA TOSHIYUKI (JP)
MURATA AKIHISA (JP)
ARIMITSU YUKIO (JP)
Application Number:
PCT/JP2001/009115
Publication Date:
July 04, 2002
Filing Date:
October 17, 2001
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
KIUCHI KAZUYUKI (JP)
OSHIMA TOSHIYUKI (JP)
MURATA AKIHISA (JP)
ARIMITSU YUKIO (JP)
KIUCHI KAZUYUKI (JP)
OSHIMA TOSHIYUKI (JP)
MURATA AKIHISA (JP)
ARIMITSU YUKIO (JP)
International Classes:
C09J5/00; C09J7/22; C09J7/38; C09J201/00; H01L21/00; (IPC1-7): C09J7/02; H01L21/00
Domestic Patent References:
| WO2000018848A1 | 2000-04-06 |
Foreign References:
| EP0612823A1 | 1994-08-31 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30)
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