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Title:
ENERGY-SENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/198887
Kind Code:
A1
Abstract:
Provided are: an energy-sensitive resin composition that provides a highly transparent polybenzoxazole resin suppressed in coloring, which has excellent chemical resistance and excellent mechanical characteristics such as tensile elongation, even in cases where a polybenzoxazole precursor is thermally treated at low temperatures; a method for producing a polybenzoxazole film or polybenzoxazole molded body using the energy-sensitive resin composition; and a pattern forming method using the energy-sensitive resin composition. An energy-sensitive resin composition according to the present invention contains: a polybenzoxazole precursor that is obtained by reacting an aromatic diamine diol with a diformyl compound or a dicarboxylic acid dihalide; a solvent; and a compound (A) that is decomposed by the action of light and/or heat and generates a base and/or an acid.

Inventors:
NODA KUNIHIRO (JP)
CHISAKA HIROKI (JP)
SHIOTA DAI (JP)
Application Number:
PCT/JP2015/066935
Publication Date:
December 30, 2015
Filing Date:
June 11, 2015
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/038; C08G73/22; G03F7/004; G03F7/40
Domestic Patent References:
WO2011067998A12011-06-09
WO2012172793A12012-12-20
Foreign References:
JP2009282084A2009-12-03
JP2010254946A2010-11-11
JP2012203359A2012-10-22
JP2004077551A2004-03-11
JP2014085635A2014-05-12
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki (JP)
Right wood Masayuki (JP)
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