Title:
ENHANCED WELDING COLUMN FABRICATION DEVICE AND FABRICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/107958
Kind Code:
A1
Abstract:
An enhanced welding column fabrication device, comprising a welding wire supplying mechanism (1), a copper strip winding mechanism (2), a copper strip dip-soldering mechanism (3), and a welding wire leveling cut-off mechanism (4); the welding wire supplying mechanism (1) provides straight welding wires; the copper strip winding mechanism (2) winds a copper strip having a certain thickness on the welding wires and the entire outer surface of the welding wires is tin-dipped by the copper strip dip-soldering mechanism (3) to obtain an enhanced welding wire; the enhanced welding wire is transferred to the welding wire leveling cut-off mechanism (4) to be leveled and cut off to obtain a plurality of enhanced welding columns. Further disclosed is an enhanced welding column fabrication method. The device and the method are easily operated, and can guarantee the good surface state and end surface flatness of the fabricated welding column.
Inventors:
HUANG YINGZHUO (CN)
LING PENGRONG (CN)
LIAN BINHAO (CN)
WANG YONG (CN)
YAO QUANBIN (CN)
LING PENGRONG (CN)
LIAN BINHAO (CN)
WANG YONG (CN)
YAO QUANBIN (CN)
Application Number:
PCT/CN2017/113266
Publication Date:
June 21, 2018
Filing Date:
November 28, 2017
Export Citation:
Assignee:
BEIJING MICROELECTRONICS TECH INSTITUTE (CN)
BEIJING MXTRONICS CORP (CN)
BEIJING MXTRONICS CORP (CN)
International Classes:
B23K35/04; B23P23/00
Foreign References:
| CN106624423A | 2017-05-10 | |||
| CN102962676A | 2013-03-13 | |||
| CN201405005Y | 2010-02-17 | |||
| CN105618952A | 2016-06-01 | |||
| GB758473A | 1956-10-03 | |||
| DE102004050677A1 | 2006-04-20 |
Attorney, Agent or Firm:
PATENT AGENT OF CHINA AEROSPACE TECHNOLOGY (CN)
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