Title:
ENVIRONMENTALLY ROBUST PASSIVATION STRUCTURES FOR HIGH-VOLTAGE SILICON CARBIDE SEMICONDUCTOR DEVICES
Document Type and Number:
WIPO Patent Application WO2007081528
Kind Code:
A8
Abstract:
An improved termination structure for high field semiconductor devices in silicon carbide is disclosed. The termination structure includes a silicon carbide-based device for high-field operation, an active region in the device, an edge termination passivation for the active region, in which the edge termination passivation includes, an oxide layer on at least some of the silicon carbide portions of the device for satisfying surface states and lowering interface density, a non-stoichiometric layer of silicon nitride on the oxide layer for avoiding the incorporation of hydrogen and for reducing parasitic capacitance and minimizing trapping, and, a stoichiometric layer of silicon nitride on the nonstoichiometric layer for encapsulating the. nonstoichiometric layer and the oxide layer.
Inventors:
WARD ALLAN III (US)
HENNING JASON PATRICK (US)
HENNING JASON PATRICK (US)
Application Number:
PCT/US2006/048817
Publication Date:
October 02, 2008
Filing Date:
December 21, 2006
Export Citation:
Assignee:
CREE INC (US)
WARD ALLAN III (US)
HENNING JASON PATRICK (US)
WARD ALLAN III (US)
HENNING JASON PATRICK (US)
International Classes:
H01L29/24; H01L21/04; H01L21/314
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