Title:
EPOXY ADHESIVES AND BONDED SUBSTRATES
Document Type and Number:
WIPO Patent Application WO2004104130
Kind Code:
A3
Abstract:
Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about -40 °C or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine; (ii) an amine curative; and (iii) an epoxide-group containing compound. The epoxy adhesives are resistant to thermal shock and have a low shear creep. The epoxy adhesives are particularly suitable for bonding substrates having mismatched coefficients of thermal expansion.
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Inventors:
CHENG MING
LU YING-YUH
LU YING-YUH
Application Number:
PCT/US2004/008672
Publication Date:
February 03, 2005
Filing Date:
March 19, 2004
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES CO (US)
International Classes:
C09J163/00; (IPC1-7): C09J163/00
Foreign References:
| US4704331A | 1987-11-03 | |||
| EP0561048A2 | 1993-09-22 |
Other References:
ANDY H. TSOU, ET AL.: "Creep of a glass-flake-reinforced epoxy adhesive for space applications", POLYMER, vol. 37, no. 24, 1996, pages 5381 - 5386, XP002301918
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