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Title:
EPOXY (METH) ACRYLATE RESIN COMPOSITION, CURABLE RESIN COMPOSITION, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2019/098114
Kind Code:
A1
Abstract:
An epoxy (meth) acrylate resin composition containing: an epoxy (meth) acrylate resin (A) having, as essential reactive raw materials thereof, an epoxy resin (a1) and a carboxyl group-containing (meth) acrylate compound (a2); and an acidic compound (B). The epoxy (meth) acrylate resin composition is characterized by: the epoxy (meth) acrylate resin (A) having an epoxy group and a (meth) acryloyl group; and the acidic compound (B) having a first acid dissociation constant (pKa1) of no more than 2.5. This epoxy (meth) acrylate resin composition is unlikely to have increased viscosity over time and has excellent storage stability.

Inventors:
YAMADA SHUNSUKE (JP)
KAMEYAMA HIROFUMI (JP)
Application Number:
PCT/JP2018/041464
Publication Date:
May 23, 2019
Filing Date:
November 08, 2018
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F299/02; C08F2/48; C08G59/17
Domestic Patent References:
WO2016067582A12016-05-06
Foreign References:
JP2009235114A2009-10-15
JP2015129927A2015-07-16
JP2017002128A2017-01-05
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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