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Title:
EPOXY (METH) ACRYLATE RESIN COMPOSITION, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/220995
Kind Code:
A1
Abstract:
The present invention provides an epoxy (meth) acrylate resin composition that contains an aromatic ester compound (A) and an epoxy (meth) acrylate resin (B) and is characterized by: the epoxy (meth) acrylate resin (B) having, as essential reaction materials therefor, an epoxy resin (b1) and a carboxyl group-containing (meth) acrylate compound (b2); and the epoxy (meth) acrylate resin (B) having an epoxy group and a (meth) acryloyl group. This epoxy (meth) acrylate resin composition can form a cured product having excellent thermal resistance and dielectric properties.

Inventors:
YAMADA Shunsuke (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
KAMEYAMA Hirofumi (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
YAMOTO Kazuhisa (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
HAYASHI Koji (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
Application Number:
JP2019/018500
Publication Date:
November 21, 2019
Filing Date:
May 09, 2019
Export Citation:
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Assignee:
DIC CORPORATION (35-58, Sakashita 3-chome Itabashi-k, Tokyo 20, 〒1748520, JP)
International Classes:
C08F299/02; C08F290/00; C08G59/42
Domestic Patent References:
WO2009063743A12009-05-22
WO2018235424A12018-12-27
Foreign References:
JP2004138835A2004-05-13
JP2013028662A2013-02-07
JP2006169423A2006-06-29
JPH059236A1993-01-19
JPS51143634A1976-12-10
JPH11349666A1999-12-21
JP2016108437A2016-06-20
JP2017088544A2017-05-25
US20020151731A12002-10-17
Attorney, Agent or Firm:
OGAWA Shinji (7-20 Nihonbashi 3-chome, Chuo-k, Tokyo 33, 〒1038233, JP)
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