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Title:
EPOXY (METH)ACRYLATE COMPOUND AND CURABLE COMPOSITION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2018/021224
Kind Code:
A1
Abstract:
[Problem] To provide an epoxy (meth)acrylate compound that serves as a material for a protective film that is unlikely to cause migration to an electrically conductive pattern, and a curable composition containing the epoxy (meth)acrylate compound. [Solution] Provided is an epoxy (meth)acrylate compound which is characterized by being represented by general formula (1) and in which the content of halogen atoms, which are impurities, is 100 ppm by mass or less. In addition, provided is a curable composition for forming a protective film for an electrically conductive pattern, the curable composition being obtained by mixing this epoxy (meth)acrylate compound with a photopolymerization initiator and at least one type of monomer or oligomer that contains a (meth)acryloyl group. Formula (1) (At least one of R1 to R5 has a structure represented by formula (2), and the remainder of R1 to R5 are each independently selected from the group consisting of hydrogen atoms and alkyl groups and alkoxy groups having 1-6 carbon atoms. R6 denotes a hydrogen atom or a methyl group.) Formula (2) (＊ denotes the bonding position to a carbon atom that constitutes the benzene ring to which R1 to R5 are bonded in formula (1), and R7 denotes a hydrogen atom or a methyl group.)

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Inventors:
TOBA MASAHIKO (JP)
DOU JUN (JP)
YAMASHITA CHIKA (JP)
ISHIBASHI YOSHITAKA (JP)
UCHIDA HIROSHI (JP)
Application Number:
PCT/JP2017/026644
Publication Date:
February 01, 2018
Filing Date:
July 24, 2017
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08G59/16; C08F2/50; C08F299/02
Domestic Patent References:
WO2012008308A12012-01-19
Foreign References:
JPS5693718A1981-07-29
JPH07304828A1995-11-21
US2965607A1960-12-20
GB841589A1960-07-20
JPS61289084A1986-12-19
JPH10511721A1998-11-10
JP2011084558A2011-04-28
JP2012150893A2012-08-09
Other References:
JIANGLEI QIN ET AL.: "Use of eugenol and rosin as feedstocks for biobased epoxy resins and study of curing and performance properties", POLYM INT, vol. 63, 2014, pages 760 - 765, XP055190792
Attorney, Agent or Firm:
ARIHARA Motoji (JP)
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