Title:
EPOXY MOLDING COMPOUND AND METHOD FOR PREPARING SAME, SEMICONDUCTOR PACKAGING STRUCTURE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/245413
Kind Code:
A1
Abstract:
Provided is an epoxy molding compound, comprising an epoxy resin pretreated by a stress absorbent, which is a mixture obtained by melt blending of a stress absorbent and an epoxy resin, the stress absorbent being a styrene-butadiene copolymer or a derivative thereof; a phenolic resin pretreated by an inorganic nanofiller, which is a mixture obtained by melt blending of a phenolic resin and an inorganic nanofiller; an inorganic microfiller; and a curing accelerator. The epoxy molding compound comprises 5-15 parts by weight of the epoxy resin, 0.1-5 parts by weight of the stress absorbent, 0.5-10 parts by weight of the inorganic nanofiller, 5-8 parts by weight of the phenolic resin, 65-90 parts by weight of the inorganic nanofiller and the inorganic microfiller, and 0.1-1.5 parts by weight of the curing accelerator. The present application further provides a method for preparing the epoxy molding compound, a semiconductor packaging structure, and an electronic apparatus. The pretreatment of the inorganic nanofiller and the stress absorbent can further reduce the modulus of the epoxy molding compound.
Inventors:
LI LEI (CN)
LIU YUNJI (CN)
CHIANG SHANGHSUAN (CN)
ZHAO NAN (CN)
FU KEXIN (CN)
LIU YUNJI (CN)
CHIANG SHANGHSUAN (CN)
ZHAO NAN (CN)
FU KEXIN (CN)
Application Number:
PCT/CN2022/100117
Publication Date:
December 28, 2023
Filing Date:
June 21, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
SHENZHEN INST OF ADV TECH CAS (CN)
SHENZHEN INST OF ADV TECH CAS (CN)
International Classes:
C08L63/00; C08K3/36; C08L61/00
Foreign References:
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| CN105778410A | 2016-07-20 | |||
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| CN106589834A | 2017-04-26 | |||
| CN107446316A | 2017-12-08 | |||
| CN109467881A | 2019-03-15 | |||
| CN111117540A | 2020-05-08 | |||
| CN111978726A | 2020-11-24 | |||
| CN112538236A | 2021-03-23 | |||
| CN112852107A | 2021-05-28 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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