Title:
EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR USING ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2022/138343
Kind Code:
A1
Abstract:
Provided is an epoxy resin composition including an epoxy resin (A) and a latent curing agent (B) wherein the latent curing agent (B) is solid at 25°C.
Inventors:
ONIZUKA KENZO (JP)
KAMIMURA NAOYA (JP)
YOSHIDA MASANORI (JP)
KAMIMURA NAOYA (JP)
YOSHIDA MASANORI (JP)
Application Number:
PCT/JP2021/046127
Publication Date:
June 30, 2022
Filing Date:
December 14, 2021
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
C09J7/35; C08G59/40; C09J11/04; C09J11/06; C09J11/08; C09J163/00; H01L21/52; H01L23/29; H01L23/31; H05K3/46
Domestic Patent References:
| WO2016080202A1 | 2016-05-26 | |||
| WO2011039879A1 | 2011-04-07 |
Foreign References:
| JP2017095570A | 2017-06-01 | |||
| JP2014156515A | 2014-08-28 | |||
| JPS6079031A | 1985-05-04 | |||
| JPS6079030A | 1985-05-04 | |||
| JP2005220205A | 2005-08-18 | |||
| JP2005179580A | 2005-07-07 | |||
| JP2019127507A | 2019-08-01 | |||
| JP2017095571A | 2017-06-01 | |||
| JP2021155508A | 2021-10-07 |
Other References:
"Sosetsu Epoxy Jushi Kisohen I", 19 November 2003, THE JAPAN SOCIETY OF EPOXY RESIN TECHNOLOGY , ISBN: 4-9900150-1-0, article EDITORIAL COMMITTEE EDITION: "Passage; Review Epoxy Resin Volume 1 (Basics 1)", pages: 186 - 191, XP009537823
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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