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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION AS WELL AS PREPREG AND LAMINATED BOARD USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2017/113522
Kind Code:
A1
Abstract:
The present invention relates to an epoxy resin composition comprising the following components: (A) an epoxy resin comprising an oxazolidinone structure, having the structure of formula (I); (B) an active ester curing agent; and (C) a curing promoting agent. The epoxy composition provided in the present invention, as well as a prepreg, a laminated board and a printed circuit board fabricated using the epoxy resin composition, have the characteristics of low thermal expansion coefficient, low dielectric loss factor with Df ≤ 0.0084, low water absorption rate and excellent moisture and heat resistance.

Inventors:
XU HAOSHENG (CN)
ZENG XIANPING (CN)
HE LIEXIANG (CN)
Application Number:
PCT/CN2016/077730
Publication Date:
July 06, 2017
Filing Date:
March 29, 2016
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
B32B17/04; C08L63/00; B32B37/10; B32B38/08; C08L79/04
Foreign References:
CN101244645A2008-08-20
CN102051022A2011-05-11
CN102399415A2012-04-04
CN1989203A2007-06-27
CN101815734A2010-08-25
CN102666633A2012-09-12
CN1333791A2002-01-30
CN101695880A2010-04-21
JP2003252958A2003-09-10
US5112932A1992-05-12
Other References:
See also references of EP 3211035A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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