Title:
EPOXY RESIN COMPOSITION AS WELL AS PREPREG AND LAMINATED BOARD USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2017/113522
Kind Code:
A1
Abstract:
The present invention relates to an epoxy resin composition comprising the following components: (A) an epoxy resin comprising an oxazolidinone structure, having the structure of formula (I); (B) an active ester curing agent; and (C) a curing promoting agent. The epoxy composition provided in the present invention, as well as a prepreg, a laminated board and a printed circuit board fabricated using the epoxy resin composition, have the characteristics of low thermal expansion coefficient, low dielectric loss factor with Df ≤ 0.0084, low water absorption rate and excellent moisture and heat resistance.
Inventors:
XU HAOSHENG (CN)
ZENG XIANPING (CN)
HE LIEXIANG (CN)
ZENG XIANPING (CN)
HE LIEXIANG (CN)
Application Number:
PCT/CN2016/077730
Publication Date:
July 06, 2017
Filing Date:
March 29, 2016
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
B32B17/04; C08L63/00; B32B37/10; B32B38/08; C08L79/04
Foreign References:
CN101244645A | 2008-08-20 | |||
CN102051022A | 2011-05-11 | |||
CN102399415A | 2012-04-04 | |||
CN1989203A | 2007-06-27 | |||
CN101815734A | 2010-08-25 | |||
CN102666633A | 2012-09-12 | |||
CN1333791A | 2002-01-30 | |||
CN101695880A | 2010-04-21 | |||
JP2003252958A | 2003-09-10 | |||
US5112932A | 1992-05-12 |
Other References:
See also references of EP 3211035A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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