Title:
EPOXY RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/032971
Kind Code:
A1
Abstract:
An epoxy resin composition for compression molding which comprises an epoxy resin including a polycyclic structure and/or two or more cyclic structures, a hardener, and an inorganic filler, the content of the inorganic filler being 87.0 mass% or higher with respect to the whole epoxy resin composition for compression molding, the epoxy resin composition having a maximum particle diameter of 2.0 mm or less.
Inventors:
HIRAI TOMOKI (JP)
Application Number:
PCT/JP2022/032567
Publication Date:
March 09, 2023
Filing Date:
August 30, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08L63/00; C08G59/20; C08K3/013; C08K3/22; H01L23/29; H01L23/31
Domestic Patent References:
| WO2009142065A1 | 2009-11-26 | |||
| WO2021075207A1 | 2021-04-22 |
Foreign References:
| JP2016089096A | 2016-05-23 | |||
| JP2016108367A | 2016-06-20 | |||
| JPH0841293A | 1996-02-13 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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