EPOXY RESIN COMPOSITION FOR COPPER CLAD LAMINATE

WIPO Patent Application WO/2005/108488

A1

The present invention relates to an epoxy resin composition for a printed circuit board (PCB). The composition of the invention comprises a) a bisphenol A type of novolak resin having an average epoxy equivalent of 100 to 500 and a multi-functional epoxy resin having at least 3 functional groups and having an average epoxy equivalent of 100 to 500, b) a curing accelerator comprising an imidazole compound, c) nanoclay as a filler, d) a brominated phenolic curing agent including 40 to 70% of bromine based on weight, and e) a bisphenol A type of novolak phenolic curing agent. Also provided are a prepreg and a copper clad laminate (CCL) using the composition. The epoxy resin composition of the present invention comprises nanoclay, which has an organic and inorganic structure, in which organic materials are intercalated into the interlayer of the layered silicate. Because it has superior heat resistance, a high glass transition temperature (T ), and superior flame retardance and mechanical properties, it is useful in manufacturing copper g clad laminates for printed circuit boards.

KIM SUNG-WOO (KR)
AHN HYEON-WOO (KR)
MIN HYUN-SUNG (KR)
LEE YONG-SEOK (KR)
KOO EUN-HAE (KR)

PCT/KR2005/001358

November 17, 2005

May 10, 2005

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LG CHEMICAL LTD (KR)
KIM SUNG-WOO (KR)
AHN HYEON-WOO (KR)
MIN HYUN-SUNG (KR)
LEE YONG-SEOK (KR)
KOO EUN-HAE (KR)

C08L63/04; C08G59/32; C08G59/62; C08K3/34; C08L63/00; C08L63/02; H05K1/03; (IPC1-7): C08L63/02; C08K3/34

US5061744A	1991-10-29
JPS63162775A	1988-07-06

YOU ME PATENT & LAW FIRM (649-10 Yoksam-don, Kangnam-ku Seoul 135-080, KR)

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