EPOXY RESIN COMPOSITION, CURED OBJECT OBTAINED THEREFROM, SEMICONDUCTOR-ENCAPSULATING MATERIAL, NOVEL PHENOLIC RESIN, AND NOVEL EPOXY RESIN

Title:

EPOXY RESIN COMPOSITION, CURED OBJECT OBTAINED THEREFROM, SEMICONDUCTOR-ENCAPSULATING MATERIAL, NOVEL PHENOLIC RESIN, AND NOVEL EPOXY RESIN

Document Type and Number:

WIPO Patent Application WO/2006/093203

Kind Code:

A1

Abstract:

An epoxy resin composition which realizes a low permittivity and a low dielectric constant, while retaining the intact heat resistance during curing reaction, which are suitable for materials for recent high-frequency type electronic parts. A phenolic resin which has, as structural parts, an aromatic hydrocarbon group (P) containing a phenolic hydroxy group and derived from a phenol, etc., a fused polycyclic aromatic hydrocarbon group (B) containing an alkoxy group and derived from methoxynaphthalene, and a divalent hydrocarbon group (X) such as a methylene group and which has in its molecular structure a structure represented by -P-B-X-, wherein 'P,' 'B,' and 'X' respectively are those structural parts, is used as a hardener for an epoxy resin or as a raw phenolic resin for an epoxy resin.

Inventors:

OGURA ICHIROU (JP)
TAKAHASHI YOSHIYUKI (JP)
SATO YUTAKA (JP)

Application Number:

PCT/JP2006/303902

Publication Date:

September 08, 2006

Filing Date:

March 01, 2006

Export Citation:

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Assignee:

DAINIPPON INK & CHEMICALS (JP)
OGURA ICHIROU (JP)
TAKAHASHI YOSHIYUKI (JP)
SATO YUTAKA (JP)

International Classes:

C08G59/62; C08G16/02; C08G59/20; H01L23/29; H01L23/31

Foreign References:

JP2004010700A	2004-01-15
JPH08301980A	1996-11-19
JPH11140167A	1999-05-25
JPH04277518A	1992-10-02
JP2004010700A	2004-01-15
JP2003201333A	2003-07-18
JPH08301980A	1996-11-19

Other References: