Title:
EPOXY RESIN, EPOXY RESIN COMPOSITION, AND CURED OBJECT OBTAINED THEREFROM, USE THEREOF, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/181719
Kind Code:
A1
Abstract:
Provided are: an epoxy resin capable of forming cured objects excellent in terms of low-dielectric characteristics and adhesiveness to metals; an epoxy resin composition; and a cured object obtained therefrom, a use thereof, and a production method therefor. The epoxy resin comprises: (A) a structural unit derived from a hydrosilylated organic compound and formed by removing a hydrogen atom from the hydrosilyl group; (B) a structural unit derived from a compound containing no epoxy group but containing a carbon-carbon unsaturated bond and formed by converting the carbon-carbon unsaturated bond to a C=C bond or a C-C bond; and (C) a structural unit derived from a compound having both a carbon-carbon unsaturated bond and an epoxy group and formed by converting the carbon-carbon unsaturated bond to a C=C bond or a C-C bond.
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Inventors:
FUKUDA NORIAKI (JP)
HARISAKI RYOTA (JP)
YAMAMOTO KATSUMASA (JP)
HARISAKI RYOTA (JP)
YAMAMOTO KATSUMASA (JP)
Application Number:
PCT/JP2018/013257
Publication Date:
October 04, 2018
Filing Date:
March 29, 2018
Export Citation:
Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C08G59/30
Domestic Patent References:
| WO2015041325A1 | 2015-03-26 | |||
| WO2014046095A1 | 2014-03-27 | |||
| WO2012111765A1 | 2012-08-23 |
Foreign References:
| JP2008505945A | 2008-02-28 | |||
| JP2011094115A | 2011-05-12 | |||
| JP2017003707A | 2017-01-05 | |||
| JP2010254814A | 2010-11-11 | |||
| JP2005272492A | 2005-10-06 | |||
| JP2003519705A | 2003-06-24 | |||
| JP2004527602A | 2004-09-09 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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