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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2016/052290
Kind Code:
A1
Abstract:
In the present invention, a triazine ring-containing phenolic resin, which is obtained by reacting melamine, a para-alkylphenol, and formalin, is used in order to provide an epoxy resin composition which imparts a cured product with excellent flame retardancy, exhibits excellent dielectric properties such as low dielectric loss tangent and low dielectric constant, and also exhibits excellent thermal conductivity, a cured product of the epoxy resin composition, and the following which use the expoxy resin composition: a prepreg; a circuit board; a build-up film; a build-up substrate; a semiconductor sealing material; a semiconductor device; a fiber-reinforced composite material; a molded article; and the like.

Inventors:
ARITA KAZUO (JP)
OKAMOTO TATSUYA (JP)
YAMOTO KAZUHISA (JP)
SATO YUTAKA (JP)
Application Number:
PCT/JP2015/076889
Publication Date:
April 07, 2016
Filing Date:
September 24, 2015
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G14/10; C08G59/62; C08J5/24; H01L23/14; H01L23/29; H01L23/31; H05K1/03
Foreign References:
CN1418899A2003-05-21
JP2009073889A2009-04-09
JPS58219253A1983-12-20
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
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