Title:
EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT, AND COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/070053
Kind Code:
A1
Abstract:
Provided is an epoxy resin which contains: a first epoxy compound having a mesogen structure; and a second epoxy compound having two or more mesogen structures identical to the mesogen structure of the first epoxy compound, wherein the proportion of the first epoxy compound as measured by liquid chromatography is 50% or less of the total epoxy resin.
Inventors:
YOSHIDA YUKA (JP)
FUKUDA KAZUMASA (JP)
TAKEZAWA YOSHITAKA (JP)
MARUYAMA NAOKI (JP)
HIGASHIUCHI TOMOKO (JP)
FUKUDA KAZUMASA (JP)
TAKEZAWA YOSHITAKA (JP)
MARUYAMA NAOKI (JP)
HIGASHIUCHI TOMOKO (JP)
Application Number:
PCT/JP2016/080631
Publication Date:
April 19, 2018
Filing Date:
October 14, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/20
Domestic Patent References:
| WO2016104772A1 | 2016-06-30 |
Foreign References:
| JP2016113540A | 2016-06-23 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF:
Previous Patent: EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT, AND COMPOSITE MATERIAL
Next Patent: MAGNET GENERATOR
Next Patent: MAGNET GENERATOR