Title:
EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT, HEAT CONDUCTIVE FILM, AND METHOD FOR PRODUCING EPOXY RESIN CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2019/159368
Kind Code:
A1
Abstract:
An epoxy resin composition that is a reaction induction-type epoxy resin composition containing an epoxy compound and a curing agent and capable of forming a smectic liquid crystal structure, that contains no filler or has a filler content of 20 mass% or less of the entire nonvolatile fraction of the epoxy resin composition.
Inventors:
TAKEZAWA YOSHITAKA (JP)
TANAKA SHINGO (JP)
HOJO FUSAO (JP)
TANAKA SHINGO (JP)
HOJO FUSAO (JP)
Application Number:
PCT/JP2018/005788
Publication Date:
August 22, 2019
Filing Date:
February 19, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/02; C08G59/62; C08J5/18; C08L63/00
Domestic Patent References:
| WO2017221810A1 | 2017-12-28 | |||
| WO2017221811A1 | 2017-12-28 | |||
| WO2017175775A1 | 2017-10-12 |
Foreign References:
| JP2011074366A | 2011-04-14 | |||
| JP2014055251A | 2014-03-27 | |||
| JP2018062604A | 2018-04-19 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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