Title:
EPOXY RESIN COMPOSITION AND CURED SUBSTANCE
Document Type and Number:
WIPO Patent Application WO/2011/114935
Kind Code:
A1
Abstract:
The disclosed epoxy resin composition has a low viscosity before curing, exhibits good fluidity during molding, and has other good properties including high resistance to heat and moisture and a low degree of thermal expansion. Said epoxy resin composition is useful, for example, as a sealing material for electric/electronic components (e.g. a semiconductor sealing material), a molding material, a layering material, or an adhesive material. The disclosed epoxy resin composition contains an epoxy resin and an epoxy resin hardener, said epoxy resin being a triepoxyethylmicrohexane epoxy resin represented by formula (1).
Inventors:
KATAYAMA ATSUHIKO (JP)
SHRESTHA NIRANJAN KUMAR (JP)
SHRESTHA NIRANJAN KUMAR (JP)
Application Number:
PCT/JP2011/055302
Publication Date:
September 22, 2011
Filing Date:
March 08, 2011
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL CO (JP)
KATAYAMA ATSUHIKO (JP)
SHRESTHA NIRANJAN KUMAR (JP)
KATAYAMA ATSUHIKO (JP)
SHRESTHA NIRANJAN KUMAR (JP)
International Classes:
C08G59/32; H01L23/29; H01L23/31
Foreign References:
| US3251861A | 1966-05-17 | |||
| JP2007197647A | 2007-08-09 | |||
| JPH103084A | 1998-01-06 | |||
| GB930431A | 1963-07-03 |
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
Kazuya Sasaki (JP)
Kazuya Sasaki (JP)
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Claims: