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Title:
EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/181813
Kind Code:
A1
Abstract:
An epoxy resin composition containing an epoxy resin having a melting point or softening point higher than 40°C, a curing agent, and a compound having a glycidyl group and a melting point of 40°C or lower.

Inventors:
INOUE YORIKO (JP)
NAKAMURA SHINYA (JP)
ENDOU YOSHINORI (JP)
Application Number:
PCT/JP2018/013454
Publication Date:
October 04, 2018
Filing Date:
March 29, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08K3/00; C08K5/54; H01L23/29; H01L23/31
Domestic Patent References:
WO2011129272A12011-10-20
WO2017057561A12017-04-06
Foreign References:
JP2014521754A2014-08-28
JP2012153885A2012-08-16
JP2016179564A2016-10-13
JP2013006981A2013-01-10
JP2015010146A2015-01-19
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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