Title:
EPOXY RESIN COMPOSITION AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/111707
Kind Code:
A1
Abstract:
This epoxy resin composition contains an epoxy resin, a curing agent and an inorganic filler, while containing chlorine-containing particles that contain an organic substance.
Inventors:
WADA MASAHIRO (JP)
Application Number:
PCT/JP2018/042951
Publication Date:
June 13, 2019
Filing Date:
November 21, 2018
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08L63/00; C08G59/18; C08K3/00; C09K3/10
Domestic Patent References:
| WO2016151733A1 | 2016-09-29 |
Foreign References:
| JP2017197620A | 2017-11-02 | |||
| JP2016113566A | 2016-06-23 | |||
| JP2009203294A | 2009-09-10 | |||
| JP2010031119A | 2010-02-12 | |||
| JP2010090216A | 2010-04-22 | |||
| JP2017084995A | 2017-05-18 | |||
| JP2017179346A | 2017-10-05 | |||
| JP2017179185A | 2017-10-05 | |||
| JP2017171925A | 2017-09-28 | |||
| US20160237303A1 | 2016-08-18 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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