Title:
EPOXY RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/087986
Kind Code:
A1
Abstract:
An epoxy resin composition for encapsulation which comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a fatty acid amide compound having 17-50 carbon atoms, wherein (D) the inorganic filler is contained in an amount exceeding 80 vol% with respect to the whole composition.
Inventors:
HORI KEICHI (JP)
KAN DONCHORU (JP)
YAMAURA MASASHI (JP)
TANAKA MIKA (JP)
KODAMA TAKUYA (JP)
ISHIBASHI KENTA (JP)
KAN DONCHORU (JP)
YAMAURA MASASHI (JP)
TANAKA MIKA (JP)
KODAMA TAKUYA (JP)
ISHIBASHI KENTA (JP)
Application Number:
PCT/JP2018/039983
Publication Date:
May 09, 2019
Filing Date:
October 26, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L23/29; C08K3/00; C08K5/20; C08L63/00; H01L23/31
Foreign References:
| JP2012244062A | 2012-12-10 | |||
| JP2010280805A | 2010-12-16 | |||
| JP2003213087A | 2003-07-30 | |||
| JP2002275245A | 2002-09-25 | |||
| JP2000281754A | 2000-10-10 | |||
| JPH10130462A | 1998-05-19 | |||
| JPS608315A | 1985-01-17 | |||
| JP2008222955A | 2008-09-25 | |||
| JP2017008153A | 2017-01-12 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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