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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION HAVING EXCELLENT ADHESIVE PROPERTIES AND RESIN COMPOSITE COPPER FOIL USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/104739
Kind Code:
A1
Abstract:
The present invention provides an epoxy resin composition and a resin-coated copper foil comprising a resin layer formed by using the epoxy resin composition, the epoxy resin composition comprising: (a) a high equivalent weight first epoxy resin of which the epoxy equivalent weight (EEW) is within the range of 400 to 1000 g/eq; (b) a low equivalent weight second epoxy resin of which the epoxy equivalent weight (EEW) is within the range of 100 to 300 g/eq; (c) a dimer acid modified epoxy resin; and (d) a hardening agent, wherein the polydispersity index (PDI) of the first epoxy resin and/or the second epoxy resin is no more than 2. The present invention can provide a build-up printed circuit board which can achieve heat resistance, can have microcircuit patterns and can secure good adhesive properties by improving the adhesive force between a copper foil and an insulation layer due to using a mixture of the hardening agent, the low equivalent weight epoxy, and the high equivalent weight epoxy having narrow molecular weight distribution and a low polydispersity index (PDI).

Inventors:
JUNG SOO IM (KR)
PARK KWANG SEOK (KR)
KIM HYUNG KYU (KR)
KIM IN WOOK (KR)
Application Number:
PCT/KR2013/012171
Publication Date:
July 03, 2014
Filing Date:
December 26, 2013
Export Citation:
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Assignee:
DOOSAN CORP (KR)
International Classes:
C08L63/00; B32B15/092; C08L63/10; H05K1/03
Foreign References:
KR101116181B12012-03-06
KR20060018273A2006-02-28
KR100907366B12009-07-10
US20070299218A12007-12-27
Attorney, Agent or Firm:
HANBEOT PATENT & LAW FIRM (KR)
특허법인 한벗 (KR)
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