Title:
EPOXY RESIN COMPOSITION, COMPOSITION FOR METAL SURFACE PROCESSING, METHOD FOR PRODUCING LAYERED METAL SHEET, AND METHOD FOR BONDING METAL SHEET
Document Type and Number:
WIPO Patent Application WO/2023/176768
Kind Code:
A1
Abstract:
The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide compound, an isocyanate-based compound, a polyetheramine-based compound, a phosphoric acid-modified epoxy resin, a melamine resin and a phenolic resin, and (D) water; a composition for metal surface processing, which contains said epoxy resin composition; a method for producing a metal sheet; and a method for bonding a metal sheet.
Inventors:
OOSATO TAKUTO (JP)
ENDO HIROTAKA (JP)
NAKATSUJI AKIRA (JP)
ENDO HIROTAKA (JP)
NAKATSUJI AKIRA (JP)
Application Number:
PCT/JP2023/009592
Publication Date:
September 21, 2023
Filing Date:
March 13, 2023
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C08L63/00; B32B15/08; B32B15/092; C08K5/16; C08K5/544; C08L61/28; C08L71/02; C09D163/00; C09J5/00; C09J11/06; C09J163/00; C23C22/05; C23C28/00
Foreign References:
| JP2003239081A | 2003-08-27 | |||
| JP2010053413A | 2010-03-11 | |||
| JP2021134325A | 2021-09-13 | |||
| JPH03237076A | 1991-10-22 | |||
| JP2018188719A | 2018-11-29 | |||
| JP2001516788A | 2001-10-02 | |||
| JP2020158670A | 2020-10-01 | |||
| JP2018040027A | 2018-03-15 | |||
| US20080081196A1 | 2008-04-03 |
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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