Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION FOR MOLDING
Document Type and Number:
WIPO Patent Application WO/2023/054884
Kind Code:
A1
Abstract:
The present invention relates to an epoxy resin composition for molding, a semiconductor device encapsulated by using same, or a vehicle part molded by using same.

More Like This:
JP4105345Resin composition for encapsulating semiconductors and semiconductor devices using them
WO/2013/015577HEAT-CURABLE RESIN COMPOSITION, AND PREPREG AND METAL FOIL-STACKED PLATE USING SAME
JPH0797526[Title of Invention] Heat Resistant Electrically Insulated Wire Ring
Inventors:
PARK CHAN YOUNG (KR)
SHIM MYOUNG TAEK (KR)
LEE EUN HAN (KR)
KONG BYUNG SEON (KR)
Application Number:
PCT/KR2022/011664
Publication Date:
April 06, 2023
Filing Date:
August 05, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KCC CORP (KR)
International Classes:
C08L63/00; C08J3/12; C08L51/00
Foreign References:
JP2006143950A2006-06-08
JP2017019988A2017-01-26
JP2011195742A2011-10-06
KR20170010577A2017-02-01
KR100830776B12008-05-20
JP2017197620A2017-11-02
Attorney, Agent or Firm:
SUNGAM SUH INTERNATIONAL PATENT & LAW FIRM (KR)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: METHOD AND APPARATUS FOR EVALUATING PERFORMANCE WITH RESPECT TO LIDAR APPARATUS

Next Patent: METHOD FOR DIFFERENTIALLY PROVIDING ALARM, AND RECORDING MEDIUM