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Title:
EPOXY RESIN COMPOSITION AND PRE-PREG, SUPPORT-PROVIDED RESIN FILM, METALLIC FOIL CLAD LAMINATE PLATE AND MULTILAYER PRINTED CIRCUIT BOARD UTILIZING SAID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/152412
Kind Code:
A1
Abstract:
The epoxy resin composition of the present invention includes a phosphorus-containing hardener (A) and an epoxy resin (B), wherein said phosphorus-containing hardener is a phosphorus compound represented by chemical formula (1), the organic group represented by R in chemical formula (1) has two or more phenolic hydroxyl groups, and the molecular weight of the organic group is at least 190.

Inventors:
YANAGIDA, Makoto (1500, Ogawa, Chikusei-sh, Ibaraki 21, 〒3088521, JP)
柳田 真 (〒21 茨城県筑西市小川1500番地 日立化成工業株式会社内 Ibaraki, 〒3088521, JP)
Application Number:
JP2011/062516
Publication Date:
December 08, 2011
Filing Date:
May 31, 2011
Export Citation:
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Assignee:
HITACHI CHEMICAL COMPANY, LTD. (1-1 Nishi-Shinjuku 2-chome, Shinjuku-ku Tokyo, 49, 〒1630449, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目1番1号 Tokyo, 〒1630449, JP)
YANAGIDA, Makoto (1500, Ogawa, Chikusei-sh, Ibaraki 21, 〒3088521, JP)
International Classes:
C08G59/62; B32B15/08; B32B27/38; C08J5/24; H05K1/03
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (OHTANI PATENT OFFICE, Bridgestone Toranomon Bldg. 6F. 25-2, Toranomon 3-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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Claims: