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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION AND PRE-PREG, SUPPORT-PROVIDED RESIN FILM, METALLIC FOIL CLAD LAMINATE PLATE AND MULTILAYER PRINTED CIRCUIT BOARD UTILIZING SAID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/152412
Kind Code:
A1
Abstract:
The epoxy resin composition of the present invention includes a phosphorus-containing hardener (A) and an epoxy resin (B), wherein said phosphorus-containing hardener is a phosphorus compound represented by chemical formula (1), the organic group represented by R in chemical formula (1) has two or more phenolic hydroxyl groups, and the molecular weight of the organic group is at least 190.

Inventors:
YANAGIDA MAKOTO (JP)
GOUZU SHUUJI (JP)
Application Number:
PCT/JP2011/062516
Publication Date:
December 08, 2011
Filing Date:
May 31, 2011
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
YANAGIDA MAKOTO (JP)
GOUZU SHUUJI (JP)
International Classes:
C08G59/62; B32B15/08; B32B27/38; C08J5/24; H05K1/03
Domestic Patent References:
WO2010106698A12010-09-23
WO2009070488A12009-06-04
Foreign References:
JP2000264956A2000-09-26
JP2001283639A2001-10-12
JP2001131393A2001-05-15
JP2002265562A2002-09-18
Other References:
See also references of EP 2578613A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
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Claims: