EPOXY RESIN COMPOSITION, PREPREG AND CURED PRODUCTS THEREOF

WIPO Patent Application WO/2010/140674

A1

Disclosed is an epoxy resin composition from which a cured product having a high heat resistance and a high heat transfer rate can be obtained. Specifically disclosed is an epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler having a heat transfer rate of 20 W/m·K or more, which contains, as said curing agent, a phenol compound obtained by reacting one or more compounds represented by formulae (1) to (5) with a hydroxybenzaldehyde, and/or, as said epoxy resin, an epoxy compound obtained by further reacting the aforesaid phenol compound with an epihalohydrin.

JPH0747620	[Title of the Invention] Epoxy resin and a method for producing the same.
JP2509673	[Title of Invention] An epoxy compound and an epoxy resin composition containing the epoxy compound as an essential component.
WO/2019/013081	EPOXY RESIN, EPOXY RESIN COMPOSITION CONTAINING SAME, AND CURED PRODUCT USING SAID EPOXY RESIN COMPOSITION

KAWAI KOUICHI
SUNAGA TAKAO
UEHARA RYUJI
INAGAKI SHINYA
OSIMI KATSUHIKO
INOUE KAZUMA

PCT/JP2010/059498

December 09, 2010

June 04, 2010

Click for automatic bibliography generation  

NIPPON KAYAKU KK (JP)
KAWAI KOUICHI
SUNAGA TAKAO
UEHARA RYUJI
INAGAKI SHINYA
OSIMI KATSUHIKO
INOUE KAZUMA

C08G59/06; C08J5/24; C08K3/00; C08L63/00; H01L23/14; H01L23/29; H01L23/31; H05K1/03

JPH09100339A	1997-04-15
JP2004137425A	2004-05-13
JP2003055434A	2003-02-26
JP2002220435A	2002-08-09
JP2002128867A	2002-05-09

NAITO, Teruo (JP)
Teruo Naito (JP)

View/Download PDF      PDF Help

Previous Patent: ORAL COMPOSITION CONTAINING ORGANIC ACID

Next Patent: INSECT PEST CONTROL METHOD