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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/003690
Kind Code:
A1
Abstract:
Provided is an epoxy resin composition with which an epoxy resin cured product with a high heat resistance and elastic modulus as well as a low colorability can be obtained, said epoxy resin composition not producing white deposits on a surface of a molded good when used as a matrix resin of a fiber-reinforced composite material, and thus having a superior external appearance. The epoxy resin composition includes an epoxy resin as a component [A] and an imidazole compound as a component [B], and satisfies the following conditions (a)-(d). (a): For the component [A], [A1] an isocyanuric acid type epoxy resin is included at 10-40 parts by mass within 100 parts by mass of the total epoxy resin. (b) : For the component [A], [A2] a bisphenol type epoxy resin is included at 40-90 parts by mass within 100 parts by mass of the total epoxy resin. (c): The average epoxy equivalent weight of [A2] is 220-500g/eq. (d): The included amount of the component [B] is an amount such that the ratio of the number of imidazoles to the number of epoxide groups within the total epoxy resin is 0.01-0.06.

Inventors:
SANO KENTARO (JP)
KURODA TAIKI (JP)
TAKAIWA REO (JP)
HIRANO NORIYUKI (JP)
Application Number:
PCT/JP2017/023188
Publication Date:
January 04, 2018
Filing Date:
June 23, 2017
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G59/38; C08G59/40; C08J5/24; C08K5/09; C08K5/3445; C08K5/55; C08L63/06
Foreign References:
JP2016023250A2016-02-08
JP2010265415A2010-11-25
JPH11111741A1999-04-23
JP2017020004A2017-01-26
JPH11209580A1999-08-03
JP2013253194A2013-12-19
JP2013133407A2013-07-08
Other References:
See also references of EP 3476880A4
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