Title:
EPOXY RESIN COMPOSITION, PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/127389
Kind Code:
A1
Abstract:
The present invention relates to an epoxy resin composition, and a prepreg, a laminate and a printed circuit board using the same. The epoxy resin composition of the present invention comprises an epoxy resin (A), a maleimide compound (B) having the structure as represented by formula (I), and an active ester compound (C). A prepreg, a laminate (comprising a metal foil-clad laminate) and a printed wiring board produced by using the epoxy resin composition have a low dielectric constant (Dk)/dielectric loss tangent value (Df), high glass transition temperature (Tg), low water absorption, low coefficient of thermal expansion (CTE), excellent heat resistance and heat and humidity resistance, and like features.
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Inventors:
DONG JINCHAO (CN)
TANG JUNQI (CN)
TANG JUNQI (CN)
Application Number:
PCT/CN2017/119904
Publication Date:
July 04, 2019
Filing Date:
December 29, 2017
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/00; B32B15/14; B32B17/06; C08J5/24; C08K5/3415; C08L25/14; C08L67/00; H05K1/03
Foreign References:
| CN107148452A | 2017-09-08 | |||
| CN103992621A | 2014-08-20 | |||
| CN106633671A | 2017-05-10 | |||
| CN105385107A | 2016-03-09 | |||
| CN104761719A | 2015-07-08 | |||
| JP2016210851A | 2016-12-15 | |||
| JP2013234328A | 2013-11-21 |
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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