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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION, AND PREPREG AND LAMINATED PLATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/101539
Kind Code:
A1
Abstract:
The present invention relates to an epoxy resin composition, and prepreg and a laminated plate using the same. The epoxy resin composition comprises: imide living modified ester and epoxy resin. A combination of the imide living modified ester and the resin has the good craft processability and solubleness, maintains an inherent good dielectric property when active ester resin curing epoxy resin is generated without secondary hydroxyl, and introduces an imide group with better heat resistance to a main chain, so as to improve the heat resistance of existing active ester. Prepreg and a laminated plate manufactured by using the composition have the advantages of a high glass-transition temperature, a low dielectric constant, a low dielectric loss value, and low water absorption.

Inventors:
HE LIEXIANG (CN)
ZENG XIANPING (CN)
Application Number:
PCT/CN2015/080536
Publication Date:
June 30, 2016
Filing Date:
June 01, 2015
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/04; B32B15/092; B32B27/04; B32B27/38; C08G59/50; H05K1/03
Foreign References:
CN104177530A2014-12-03
CN104031354A2014-09-10
CN104031222A2014-09-10
CN104211846A2014-12-17
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
北京品源专利代理有限公司 (CN)
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