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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION, PREPREG AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2019/244879
Kind Code:
A1
Abstract:
This epoxy resin composition contains an (A) ingredient, a (B) ingredient, a (C) ingredient and a (D) ingredient; the content ratio for the (A) ingredient is between 60 parts by mass and 90 parts by mass inclusive with respect to 100 parts by mass of the total content of the epoxy resin contained in this epoxy resin composition; the content ratio for the (B) ingredient is between 10 parts by mass and 40 parts by mass inclusive with respect to 100 parts by mass of the total content for the epoxy resin contained in this epoxy resin composition; this epoxy resin composition has a property that, when cured and turned into a cured product, the glass transition temperature of the cured product is 200°C or higher; and the viscosity at 100°C of the resin composition comprising the (A) ingredient, the (B) ingredient, the (C) ingredient, and the (D) ingredient is between 5 Pa·s and 35 Pa·s inclusive. (A): aromatic epoxy resin having at least three glycidyl groups within one molecule (B): aromatic epoxy resin having two glycidyl groups within one molecule (C): aromatic polysulfone resin having a reduced viscosity of between 0.18 dl/g and 0.30 dl/g inclusive (D): aromatic amine compound

Inventors:
KOHINATA YUSAKU (JP)
Application Number:
PCT/JP2019/024067
Publication Date:
December 26, 2019
Filing Date:
June 18, 2019
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08J5/24; C08G59/50; C08K5/17; C08L63/00; C08L81/06
Foreign References:
JP6118009B12017-04-19
JP2012021086A2012-02-02
JP2009167333A2009-07-30
JP2010254955A2010-11-11
JP2016074922A2016-05-12
JP2012505267A2012-03-01
JP2012046616A2012-03-08
JP2016169381A2016-09-23
JP2010001446A2010-01-07
JP2018117258A2018-07-26
JP2006291094A2006-10-26
Other References:
See also references of EP 3812412A4
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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