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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/181600
Kind Code:
A1
Abstract:
An epoxy resin composition for sealing, which contains (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler, and which is configured such that the inorganic filler contains 75% by mass to 98% by mass of alumina relative to the total mass of the inorganic filler.

Inventors:
TANAKA MIKA (JP)
HORI KEICHI (JP)
KAN DONCHORU (JP)
YAMAURA MASASHI (JP)
Application Number:
PCT/JP2018/013017
Publication Date:
October 04, 2018
Filing Date:
March 28, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08K3/22; H01L23/29; H01L23/31
Foreign References:
JP2005206725A2005-08-04
JP2008063571A2008-03-21
JP2007262398A2007-10-11
JPH04202522A1992-07-23
JP2008297530A2008-12-11
JP2006028264A2006-02-02
JPS62141021A1987-06-24
JP2004115747A2004-04-15
JPS63142025A1988-06-14
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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