Title:
EPOXY RESIN COMPOSITION, SEALING MATERIAL, AND IMAGE DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190191
Kind Code:
A1
Abstract:
This epoxy resin composition comprises an epoxy resin, a styrene-based viscosity adjuster, polyisobutylene and a compatibilizer. The compatibilizer has a diblock structure containing a styrene-derived structure and an olefin-derived structure. The mixing ratio of the compatibilizer is 30-120 parts by mass with respect to 100 parts by mass of the polyisobutylene. The mixing ratio of the compatibilizer is 80-350 parts by mass with respect to 100 parts by mass of the styrene-based viscosity adjuster.
Inventors:
SUDA KAORU (JP)
MIYAO HIROSHI (JP)
MIYAO HIROSHI (JP)
Application Number:
PCT/JP2023/011893
Publication Date:
October 05, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08L63/00; C08L23/20; C08L25/04
Domestic Patent References:
| WO2018235824A1 | 2018-12-27 | |||
| WO2020031941A1 | 2020-02-13 | |||
| WO2015068805A1 | 2015-05-14 | |||
| WO2011062167A1 | 2011-05-26 |
Foreign References:
| JP2016066471A | 2016-04-28 | |||
| JPH01275620A | 1989-11-06 | |||
| JP2020019959A | 2020-02-06 |
Attorney, Agent or Firm:
IKUMI PATENT ATTORNEYS OFFICE (JP)
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